WenYI Electronics Electronics Co.,Ltd

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1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers

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WenYI Electronics Electronics Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrJohnson
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1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers

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Brand Name :Wenyi Electronics
Model Number :GPI-Flex-C-007
Certification :RoHs,SGS,ISO9001:2008
Place of Origin :Made In China
MOQ :500 pcs/ lot
Price :Negotiable
Payment Terms :T/T, L/C, D/A, D/P, Western Union, MoneyGram
Supply Ability :20000 square meters/ month
Delivery Time :12-15 working days afer sample approval
Packaging Details :each in ploybag, then in carton box, or as per request.
Material :1 OZ copper
layer :1-8 layers
Print :silkscreen
Finger :sink gold or tin plated
Type :EMI shield
Pitch :1mm Pitch
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1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers

Item decription:

Gold finger 1mm Pitch double side EMI shield FPC flexible printed circuit

Material: Polymide,

Cover film: PI cover film

Type: EMI Shield

Copper : 1 OZ

Finger Pitch: 1 mm gold finger

Stiffener: PI

Thickness: 0.27mm -0.36mm.

Business Terms:

MOQ : 500 pcs/ lot

Sample lead time: 8-12 working days

Mass production lead time: 10-14 working days , as per order Qty.

Our Advantage:

  1. Strong R&D capability
  2. Low cost and competitive price
  3. Stable in quality
  4. EMI Shield anti- interface
  5. Quick delivery
  6. Capable to make 1-8 layers FPC

Application:

  1. * Household appliances
  2. * Security systems, Bank POS machine payment service system.
  3. * High Precision PCB and High Density PCB
  4. * Various industrial touch panel use
  5. * Membrane Control Panel and device

Technical specification:

Monthly output 5000 square meters.
Material Polymide, Polyster,
File format CAD file(POWERPCB,PROTEL,PADS2000,AUTOCAD,ORCAD, Gerber file
Solder resist (solder mask) Laminated cover film,Liquid photosensitive prevent weld ink,PI oil film
Surface treatment Hot Air Solder Leveling,Tinning ,Sink tin ,gold-plating ,Chemistry sink gold ,Anti-oxidation ,Sink copper ,Tin copper
Finished Thickness 0.068-0.6mm
Max thin wire/spacing 2-3mil
Min Hole Diameter 0.2mm
Max Outline 500×350mm
Mass Production Lead time 8-12 working days since order issue

1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers

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