WenYI Electronics Electronics Co.,Ltd
WenYI Electronics Electronics Co.,Ltd Customer's satifying is our gold medal, Win-Win cooperation in business is the real business.
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Backlight LGF Module Quick Turn Flex Circuits Multilayer Flexible Circuits RoHs Approval
Item decription:
Mobile Smart Device Backlight LGF Module FPC Flexible Printed Circuit
Material: Polymide, LGF
Cover film: PI cover film
Type: LGF backlight module ( LED backlight )
Copper : 0.5 OZ
Finger Pitch: 1 mm gold finger
Stiffener: PI
Thickness: 0.27mm -0.36mm.
Business Terms:
MOQ : 500 pcs/ lot
Sample lead time: 8-12 working days
Mass production lead time: 10-14 working days , as per order Qty.
Payment By T/T or LC or others.
Our Advantage:
Application:
Technical specification:
| FPC Manufacturing Capability | Technical Performance Data |
| Finished FPC Size | Min.:4x4mm Max.:250x1200mm |
| FPC Board Thickness: | 0.08-0.12mm for single layer, 0.12-0.22mm for double layer |
| Stiffener Material Choice | PI.PET,FR4-PI |
| Pitch of the Pin | 0.3mm, 0.5mm,0.8mm,1.0mm, 1.25mm,2.54mm |
| Finished Board Thickness Tolerance | ±0.03mm |
| Finished hole diameter(Min.) | 0.15mm |
| Finished hole diameter(Max) | 0.6mm |
| NPTH Hole diameter tolerance | ±0.025mm |
| PTH hole diameter tolerance | ±0.050mm |
| Copper foil thickness | 18um,35um,70um/ |
| Circuit width/spacing(Min.) | ≥0.065mm(1/2oz)≥0.05mm(1/3oz) |
| Surface Finished type | OSP.Gold plating,Immersion Gold,Tin plating(lead free)etc |
| Gold Flash Ni/Au thickness | Ni:2.54-9um Au:0.025-0.5um |
| Immersion Tin thickness | 0.7-1.2um |
| Tin plating thickness | 3-15um |
| Drill hole position tolerance | ±0.05mm |
| Punching dimension tolerance | ±0.05mm |
| Certificate | ROHS,UL,ISO9001 SGS, etc |
